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CVE-2017-18157

Qualcomm Technologies, Inc. / Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear PUBLISHED

Description (CNA)

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.

Affected (CNA)

Vendor / productVersions
Qualcomm Technologies, Inc. / Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wearaffected MDM9206; affected MDM9607; affected MDM9650; affected MSM8909W; affected MSM8996AU; affected SD 210/SD 212/SD 205; affected SD 425; affected SD 450; affected SD 615/16/SD 415; affected SD 625; affected SD 650/52; affected SD 820; affected SD 820A; affected SD 835; affected SD 845; affected SDX20

CWE

No CWE identifiers supplied.

References

ADP enrichment

CVE

No English description supplied.