Description (CNA)
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.
Affected (CNA)
| Vendor / product | Versions |
|---|---|
| Qualcomm, Inc. / Snapdragon Mobile | affected SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820 |
CWE
No CWE identifiers supplied.
References
- https://www.qualcomm.com/company/product-security/bulletins
- http://www.securitytracker.com/id/1041432
- https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
ADP enrichment
No English description supplied.