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CVE-2022-40504

Reachable assertion in Modem PUBLISHED

Description (CNA)

Transient DOS due to reachable assertion in Modem when UE received Downlink Data Indication message from the network.

Affected (CNA)

Vendor / productVersions
Qualcomm, Inc. / Snapdragonaffected 315 5G IoT Modem; affected APQ8017; affected AQT1000; affected AR8035; affected CSRA6620; affected CSRA6640; affected CSRB31024; affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6800; affected FastConnect 6900; affected FastConnect 7800; affected FSM10055; affected QCA6174A; affected QCA6310; affected QCA6335; affected QCA6391; affected QCA6420; affected QCA6421; affected QCA6426; affected QCA6430; affected QCA6431; affected QCA6436; affected QCA6564AU; affected QCA6574A; affected QCA6574AU; affected QCA6595AU; affected QCA6696; affected QCA6698AQ; affected QCA8081; affected QCA8337; affected QCA9377; affected QCM2290; affected QCM4290; affected QCM4325; affected QCM4490; affected QCM6125; affected QCM6490; affected QCN6024; affected QCN9024; affected QCS2290; affected QCS410; affected QCS4290; affected QCS4490; affected QCS610; affected QCS6125; affected QCS6490; affected Qualcomm 205 Mobile Platform; affected Qualcomm 215 Mobile Platform; affected Robotics RB3 Platform; affected SA6145P; affected SA6150P; affected SA6155; affected SA6155P; affected SA8145P; affected SA8150P; affected SA8155; affected SA8155P; affected SA8195P; affected SC8180X+SDX55; affected SD 455; affected SD 675; affected SD460; affected SD626; affected SD660; affected SD662; affected SD670; affected SD675; affected SD730; affected SD855; affected SD865 5G; affected SD888; affected SDX55; affected SDX57M; affected SG4150P; affected SM4450; affected SM6250; affected SM6250P; affected SM7250P; affected SM7315; affected SM7325P; affected Smart Audio 400 Platform; affected Smart Display 200 Platform (APQ5053-AA); affected Snapdragon 210 Processor; affected Snapdragon 212 Mobile Platform; affected Snapdragon 4 Gen 1 Mobile Platform; affected Snapdragon 425 Mobile Platform; affected Snapdragon 427 Mobile Platform; affected Snapdragon 429 Mobile Platform; affected Snapdragon 435 Mobile Platform; affected Snapdragon 439 Mobile Platform; affected Snapdragon 450 Mobile Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 480 5G Mobile Platform; affected Snapdragon 480+ 5G Mobile Platform (SM4350-AC); affected Snapdragon 625 Mobile Platform; affected Snapdragon 626 Mobile Platform; affected Snapdragon 630 Mobile Platform; affected Snapdragon 632 Mobile Platform; affected Snapdragon 636 Mobile Platform; affected Snapdragon 660 Mobile Platform; affected Snapdragon 662 Mobile Platform; affected Snapdragon 665 Mobile Platform; affected Snapdragon 670 Mobile Platform; affected Snapdragon 675 Mobile Platform; affected Snapdragon 678 Mobile Platform (SM6150-AC); affected Snapdragon 680 4G Mobile Platform; affected Snapdragon 685 4G Mobile Platform (SM6225-AD); affected Snapdragon 690 5G Mobile Platform; affected Snapdragon 695 5G Mobile Platform; affected Snapdragon 710 Mobile Platform; affected Snapdragon 712 Mobile Platform; affected Snapdragon 720G Mobile Platform; affected Snapdragon 730 Mobile Platform (SM7150-AA); affected Snapdragon 730G Mobile Platform (SM7150-AB); affected Snapdragon 732G Mobile Platform (SM7150-AC); affected Snapdragon 750G 5G Mobile Platform; affected Snapdragon 765 5G Mobile Platform (SM7250-AA); affected Snapdragon 765G 5G Mobile Platform (SM7250-AB); affected Snapdragon 768G 5G Mobile Platform (SM7250-AC); affected Snapdragon 778G 5G Mobile Platform; affected Snapdragon 778G+ 5G Mobile Platform (SM7325-AE); affected Snapdragon 780G 5G Mobile Platform; affected Snapdragon 782G Mobile Platform (SM7325-AF); affected Snapdragon 7c Compute Platform (SC7180-AC); affected Snapdragon 7c Gen 2 Compute Platform (SC7180-AD) "Rennell Pro"; affected Snapdragon 7c+ Gen 3 Compute; affected Snapdragon 8 Gen 1 Mobile Platform; affected Snapdragon 8+ Gen 1 Mobile Platform; affected Snapdragon 845 Mobile Platform; affected Snapdragon 850 Mobile Compute Platform; affected Snapdragon 855 Mobile Platform; affected Snapdragon 855+/860 Mobile Platform (SM8150-AC); affected Snapdragon 865 5G Mobile Platform; affected Snapdragon 865+ 5G Mobile Platform (SM8250-AB); affected Snapdragon 870 5G Mobile Platform (SM8250-AC); affected Snapdragon 888 5G Mobile Platform; affected Snapdragon 888+ 5G Mobile Platform (SM8350-AC); affected Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite"; affected Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite"; affected Snapdragon 8cx Compute Platform (SC8180X-AA, AB); affected Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro"; affected Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro"; affected Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB); affected Snapdragon Auto 5G Modem-RF; affected Snapdragon W5+ Gen 1 Wearable Platform; affected Snapdragon X20 LTE Modem; affected Snapdragon X24 LTE Modem; affected Snapdragon X50 5G Modem-RF System; affected Snapdragon X55 5G Modem-RF System; affected Snapdragon X65 5G Modem-RF System; affected Snapdragon X70 Modem-RF System; affected Snapdragon XR1 Platform; affected Snapdragon XR2 5G Platform; affected Snapdragon Auto 4G Modem; affected SW5100; affected SW5100P; affected SXR1120; affected SXR2130; affected Vision Intelligence 100 Platform (APQ8053-AA); affected Vision Intelligence 200 Platform (APQ8053-AC); affected Vision Intelligence 300 Platform; affected Vision Intelligence 400 Platform; affected WCD9326; affected WCD9335; affected WCD9340; affected WCD9341; affected WCD9360; affected WCD9370; affected WCD9371; affected WCD9375; affected WCD9380; affected WCD9385; affected WCN3610; affected WCN3615; affected WCN3660; affected WCN3660B; affected WCN3680; affected WCN3680B; affected WCN3910; affected WCN3950; affected WCN3980; affected WCN3988; affected WCN3990; affected WCN6740; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8832; affected WSA8835

CWE

CWE-617

References

ADP enrichment

CVE

No English description supplied.