Description (CNA)
Memory Corruption in Core during syscall for Sectools Fuse comparison feature.
Affected (CNA)
| Vendor / product | Versions |
|---|---|
| Qualcomm, Inc. / Snapdragon | affected FastConnect 6700; affected FastConnect 6900; affected QCA6391; affected QCM6490; affected QCS6490; affected QSM8350; affected Qualcomm Video Collaboration VC3 Platform; affected SD888; affected SM7315; affected SM7325P; affected Snapdragon 778G 5G Mobile Platform; affected Snapdragon 778G+ 5G Mobile Platform (SM7325-AE); affected Snapdragon 780G 5G Mobile Platform; affected Snapdragon 782G Mobile Platform (SM7325-AF); affected Snapdragon 7c+ Gen 3 Compute; affected Snapdragon 888 5G Mobile Platform; affected Snapdragon 888+ 5G Mobile Platform (SM8350-AC); affected WCD9370; affected WCD9375; affected WCD9380; affected WCD9385; affected WCN6740; affected WSA8830; affected WSA8835 |
CWE
CWE-20
References
ADP enrichment
No English description supplied.
No English description supplied.
No references supplied.