Description (CNA)
Memory Corruption in camera while installing a fd for a particular DMA buffer.
Affected (CNA)
| Vendor / product | Versions |
|---|---|
| Qualcomm, Inc. / Snapdragon | affected AQT1000; affected C-V2X 9150; affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6800; affected FastConnect 6900; affected QAM8295P; affected QCA6391; affected QCA6420; affected QCA6426; affected QCA6430; affected QCA6436; affected QCA6574AU; affected QCA6696; affected QCA8337; affected QCN9074; affected QCS410; affected QCS610; affected QCS6490; affected QCS8155; affected QSM8250; affected Qualcomm Video Collaboration VC1 Platform; affected Qualcomm Video Collaboration VC3 Platform; affected SA6145P; affected SA6150P; affected SA6155P; affected SA8145P; affected SA8150P; affected SA8155P; affected SA8195P; affected SA8295P; affected SD855; affected SD865 5G; affected SDX55; affected Snapdragon 855 Mobile Platform; affected Snapdragon 855+/860 Mobile Platform (SM8150-AC); affected Snapdragon 865 5G Mobile Platform; affected Snapdragon 865+ 5G Mobile Platform (SM8250-AB); affected Snapdragon 870 5G Mobile Platform (SM8250-AC); affected Snapdragon W5+ Gen 1 Wearable Platform; affected Snapdragon Wear 4100+ Platform; affected Snapdragon X55 5G Modem-RF System; affected Snapdragon XR2 5G Platform; affected SW5100; affected SW5100P; affected SXR2130; affected WCD9341; affected WCD9370; affected WCD9380; affected WCN3610; affected WCN3660B; affected WCN3680B; affected WCN3950; affected WCN3980; affected WCN3988; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8835 |
CWE
CWE-416
References
ADP enrichment
No English description supplied.