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CVE-2023-33049

Improper Release of Memory Before Removing Last Reference in Multi-Mode Call Processor PUBLISHED

Description (CNA)

Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage.

Affected (CNA)

Vendor / productVersions
Qualcomm, Inc. / Snapdragonaffected 315 5G IoT Modem; affected AR8035; affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6800; affected FastConnect 6900; affected FastConnect 7800; affected QCA6174A; affected QCA6391; affected QCA6421; affected QCA6426; affected QCA6431; affected QCA6436; affected QCA6574A; affected QCA6584AU; affected QCA6595AU; affected QCA6696; affected QCA6698AQ; affected QCA8081; affected QCA8337; affected QCC710; affected QCM4490; affected QCM6490; affected QCM8550; affected QCN6024; affected QCN6224; affected QCN6274; affected QCN9024; affected QCS4490; affected QCS6490; affected QCS8550; affected QEP8111; affected QFW7114; affected QFW7124; affected Qualcomm Video Collaboration VC3 Platform; affected SD855; affected SD865 5G; affected SD888; affected SDX55; affected SDX57M; affected SG8275P; affected SM7250P; affected SM7315; affected SM7325P; affected SM8550P; affected Snapdragon 4 Gen 1 Mobile Platform; affected Snapdragon 4 Gen 2 Mobile Platform; affected Snapdragon 480 5G Mobile Platform; affected Snapdragon 480+ 5G Mobile Platform (SM4350-AC); affected Snapdragon 690 5G Mobile Platform; affected Snapdragon 695 5G Mobile Platform; affected Snapdragon 750G 5G Mobile Platform; affected Snapdragon 765 5G Mobile Platform (SM7250-AA); affected Snapdragon 765G 5G Mobile Platform (SM7250-AB); affected Snapdragon 768G 5G Mobile Platform (SM7250-AC); affected Snapdragon 778G 5G Mobile Platform; affected Snapdragon 778G+ 5G Mobile Platform (SM7325-AE); affected Snapdragon 780G 5G Mobile Platform; affected Snapdragon 782G Mobile Platform (SM7325-AF); affected Snapdragon 7c+ Gen 3 Compute; affected Snapdragon 8 Gen 1 Mobile Platform; affected Snapdragon 8 Gen 2 Mobile Platform; affected Snapdragon 8 Gen 3 Mobile Platform; affected Snapdragon 8+ Gen 1 Mobile Platform; affected Snapdragon 8+ Gen 2 Mobile Platform; affected Snapdragon 855 Mobile Platform; affected Snapdragon 855+/860 Mobile Platform (SM8150-AC); affected Snapdragon 865 5G Mobile Platform; affected Snapdragon 865+ 5G Mobile Platform (SM8250-AB); affected Snapdragon 870 5G Mobile Platform (SM8250-AC); affected Snapdragon 888 5G Mobile Platform; affected Snapdragon 888+ 5G Mobile Platform (SM8350-AC); affected Snapdragon Auto 5G Modem-RF; affected Snapdragon Auto 5G Modem-RF Gen 2; affected Snapdragon X35 5G Modem-RF System; affected Snapdragon X55 5G Modem-RF System; affected Snapdragon X65 5G Modem-RF System; affected Snapdragon X70 Modem-RF System; affected Snapdragon X75 5G Modem-RF System; affected Snapdragon XR2 5G Platform; affected SXR2130; affected WCD9340; affected WCD9341; affected WCD9360; affected WCD9370; affected WCD9375; affected WCD9380; affected WCD9385; affected WCD9390; affected WCD9395; affected WCN3950; affected WCN3988; affected WCN6740; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8832; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H

CWE

CWE-401

References

ADP enrichment

CVE

No English description supplied.

CISA-ADP

No English description supplied.

No references supplied.