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CVE-2023-33092

Buffer Copy Without Checking Size of Input in Bluetooth HOST PUBLISHED

Description (CNA)

Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size.

Affected (CNA)

Vendor / productVersions
Qualcomm, Inc. / Snapdragonaffected AQT1000; affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6800; affected FastConnect 6900; affected FastConnect 7800; affected QCA6310; affected QCA6320; affected QCA6391; affected QCA6420; affected QCA6430; affected QCM4325; affected QCM4490; affected QCM5430; affected QCM6490; affected QCM8550; affected QCS4490; affected QCS5430; affected QCS6490; affected QCS7230; affected QCS8250; affected QCS8550; affected Qualcomm 215 Mobile Platform; affected Qualcomm Video Collaboration VC3 Platform; affected Qualcomm Video Collaboration VC5 Platform; affected SD730; affected SD835; affected SD855; affected SD888; affected SG4150P; affected SM6250; affected SM7250P; affected SM7315; affected SM7325P; affected SM8550P; affected Snapdragon 4 Gen 1 Mobile Platform; affected Snapdragon 4 Gen 2 Mobile Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 480 5G Mobile Platform; affected Snapdragon 480+ 5G Mobile Platform (SM4350-AC); affected Snapdragon 662 Mobile Platform; affected Snapdragon 680 4G Mobile Platform; affected Snapdragon 685 4G Mobile Platform (SM6225-AD); affected Snapdragon 690 5G Mobile Platform; affected Snapdragon 695 5G Mobile Platform; affected Snapdragon 720G Mobile Platform; affected Snapdragon 730 Mobile Platform (SM7150-AA); affected Snapdragon 730G Mobile Platform (SM7150-AB); affected Snapdragon 732G Mobile Platform (SM7150-AC); affected Snapdragon 765 5G Mobile Platform (SM7250-AA); affected Snapdragon 765G 5G Mobile Platform (SM7250-AB); affected Snapdragon 768G 5G Mobile Platform (SM7250-AC); affected Snapdragon 778G 5G Mobile Platform; affected Snapdragon 778G+ 5G Mobile Platform (SM7325-AE); affected Snapdragon 780G 5G Mobile Platform; affected Snapdragon 782G Mobile Platform (SM7325-AF); affected Snapdragon 7c+ Gen 3 Compute; affected Snapdragon 8 Gen 1 Mobile Platform; affected Snapdragon 8 Gen 2 Mobile Platform; affected Snapdragon 8+ Gen 2 Mobile Platform; affected Snapdragon 835 Mobile PC Platform; affected Snapdragon 855 Mobile Platform; affected Snapdragon 855+/860 Mobile Platform (SM8150-AC); affected Snapdragon 865 5G Mobile Platform; affected Snapdragon 865+ 5G Mobile Platform (SM8250-AB); affected Snapdragon 870 5G Mobile Platform (SM8250-AC); affected Snapdragon 888 5G Mobile Platform; affected Snapdragon 888+ 5G Mobile Platform (SM8350-AC); affected Snapdragon X55 5G Modem-RF System; affected WCD9326; affected WCD9335; affected WCD9340; affected WCD9341; affected WCD9370; affected WCD9375; affected WCD9380; affected WCD9385; affected WCD9390; affected WCD9395; affected WCN3615; affected WCN3660B; affected WCN3680B; affected WCN3950; affected WCN3980; affected WCN3988; affected WCN3990; affected WCN6740; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8832; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H

CWE

CWE-120

References

ADP enrichment

CVE

No English description supplied.

CISA-ADP

No English description supplied.

No references supplied.