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CVE-2023-33117

Use After Free in Audio PUBLISHED

Description (CNA)

Memory corruption when HLOS allocates the response payload buffer to copy the data received from ADSP in response to AVCS_LOAD_MODULE command.

Affected (CNA)

Vendor / productVersions
Qualcomm, Inc. / Snapdragonaffected AR8035; affected CSRA6620; affected CSRA6640; affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6800; affected FastConnect 6900; affected FastConnect 7800; affected Flight RB5 5G Platform; affected QAM8255P; affected QAM8295P; affected QAM8650P; affected QAM8775P; affected QCA6174A; affected QCA6391; affected QCA6421; affected QCA6426; affected QCA6431; affected QCA6436; affected QCA6574; affected QCA6574A; affected QCA6574AU; affected QCA6595; affected QCA6595AU; affected QCA6696; affected QCA6698AQ; affected QCA6797AQ; affected QCA8081; affected QCA8337; affected QCA9377; affected QCC710; affected QCM2290; affected QCM4290; affected QCM4325; affected QCM6490; affected QCM8550; affected QCN6224; affected QCN6274; affected QCN9011; affected QCN9012; affected QCS2290; affected QCS410; affected QCS4290; affected QCS610; affected QCS6490; affected QCS7230; affected QCS8250; affected QCS8550; affected QFW7114; affected QFW7124; affected QRB5165M; affected QRB5165N; affected Qualcomm 215 Mobile Platform; affected Qualcomm Video Collaboration VC1 Platform; affected Qualcomm Video Collaboration VC3 Platform; affected Qualcomm Video Collaboration VC5 Platform; affected Robotics RB5 Platform; affected SA4150P; affected SA4155P; affected SA6145P; affected SA6150P; affected SA6155P; affected SA8145P; affected SA8150P; affected SA8155P; affected SA8195P; affected SA8255P; affected SA8295P; affected SD660; affected SD865 5G; affected SD888; affected SG4150P; affected SG8275P; affected SM4125; affected SM7250P; affected SM7315; affected SM7325P; affected SM8550P; affected Smart Audio 400 Platform; affected Snapdragon 4 Gen 1 Mobile Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 480 5G Mobile Platform; affected Snapdragon 480+ 5G Mobile Platform (SM4350-AC); affected Snapdragon 660 Mobile Platform; affected Snapdragon 662 Mobile Platform; affected Snapdragon 680 4G Mobile Platform; affected Snapdragon 685 4G Mobile Platform (SM6225-AD); affected Snapdragon 690 5G Mobile Platform; affected Snapdragon 695 5G Mobile Platform; affected Snapdragon 750G 5G Mobile Platform; affected Snapdragon 765 5G Mobile Platform (SM7250-AA); affected Snapdragon 765G 5G Mobile Platform (SM7250-AB); affected Snapdragon 768G 5G Mobile Platform (SM7250-AC); affected Snapdragon 778G 5G Mobile Platform; affected Snapdragon 778G+ 5G Mobile Platform (SM7325-AE); affected Snapdragon 780G 5G Mobile Platform; affected Snapdragon 782G Mobile Platform (SM7325-AF); affected Snapdragon 7c+ Gen 3 Compute; affected Snapdragon 8 Gen 2 Mobile Platform; affected Snapdragon 8+ Gen 2 Mobile Platform; affected Snapdragon 865 5G Mobile Platform; affected Snapdragon 865+ 5G Mobile Platform (SM8250-AB); affected Snapdragon 870 5G Mobile Platform (SM8250-AC); affected Snapdragon 888 5G Mobile Platform; affected Snapdragon 888+ 5G Mobile Platform (SM8350-AC); affected Snapdragon Auto 5G Modem-RF; affected Snapdragon W5+ Gen 1 Wearable Platform; affected Snapdragon X12 LTE Modem; affected Snapdragon X55 5G Modem-RF System; affected Snapdragon X75 5G Modem-RF System; affected Snapdragon XR2 5G Platform; affected Snapdragon XR2+ Gen 1 Platform; affected SW5100; affected SW5100P; affected SXR2130; affected WCD9326; affected WCD9335; affected WCD9340; affected WCD9341; affected WCD9370; affected WCD9375; affected WCD9380; affected WCD9385; affected WCD9390; affected WCD9395; affected WCN3615; affected WCN3660B; affected WCN3680B; affected WCN3910; affected WCN3950; affected WCN3980; affected WCN3988; affected WCN3990; affected WCN6740; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H

CWE

CWE-416

References

ADP enrichment

CVE

No English description supplied.

CISA-ADP

No English description supplied.

No references supplied.