CVE-2024-23374 — Stack-based Buffer Overflow in Power Management IC

Description (CNA)

Memory corruption is possible when an attempt is made from userspace or console to write some haptics effects pattern to the haptics debugfs file.

Affected (CNA)

Vendor / product	Versions
Qualcomm, Inc. / Snapdragon	affected FastConnect 6900; affected FastConnect 7800; affected QCA6174A; affected QCA6574AU; affected QCA6584AU; affected QCA6696; affected QCA6698AQ; affected QCA9367; affected QCA9377; affected SA6145P; affected SA6150P; affected SA6155P; affected SA8145P; affected SA8150P; affected SA8155P; affected SA8195P; affected Snapdragon 8 Gen 1 Mobile Platform; affected Snapdragon Auto 5G Modem-RF Gen 2; affected Snapdragon W5+ Gen 1 Wearable Platform; affected SW5100; affected SW5100P; affected WCD9380; affected WCN3980; affected WCN3988; affected WSA8830; affected WSA8835

Vendor / product

Versions

Qualcomm, Inc. / Snapdragon

affected FastConnect 6900; affected FastConnect 7800; affected QCA6174A; affected QCA6574AU; affected QCA6584AU; affected QCA6696; affected QCA6698AQ; affected QCA9367; affected QCA9377; affected SA6145P; affected SA6150P; affected SA6155P; affected SA8145P; affected SA8150P; affected SA8155P; affected SA8195P; affected Snapdragon 8 Gen 1 Mobile Platform; affected Snapdragon Auto 5G Modem-RF Gen 2; affected Snapdragon W5+ Gen 1 Wearable Platform; affected SW5100; affected SW5100P; affected WCD9380; affected WCN3980; affected WCN3988; affected WSA8830; affected WSA8835

CWE

CWE-121

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/october-2024-bulletin.html

ADP enrichment

CISA-ADP

No English description supplied.

No references supplied.