CVE-2024-23382 — Use After Free in Graphics Linux

Description (CNA)

Memory corruption while processing graphics kernel driver request to create DMA fence.

Affected (CNA)

Vendor / product	Versions
Qualcomm, Inc. / Snapdragon	affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6900; affected FastConnect 7800; affected Flight RB5 5G Platform; affected QAM8255P; affected QAM8295P; affected QAM8620P; affected QAM8650P; affected QAM8775P; affected QAMSRV1H; affected QAMSRV1M; affected QCA6391; affected QCA6574; affected QCA6574A; affected QCA6574AU; affected QCA6595; affected QCA6595AU; affected QCA6678AQ; affected QCA6696; affected QCA6698AQ; affected QCA6797AQ; affected QCM4325; affected QCM4490; affected QCM5430; affected QCM6125; affected QCM6490; affected QCM8550; affected QCS4490; affected QCS5430; affected QCS6125; affected QCS6490; affected QCS7230; affected QCS8250; affected QCS8550; affected QRB5165N; affected Qualcomm Video Collaboration VC1 Platform; affected Qualcomm Video Collaboration VC3 Platform; affected Qualcomm Video Collaboration VC5 Platform; affected Robotics RB5 Platform; affected SA6155P; affected SA7255P; affected SA7775P; affected SA8155P; affected SA8195P; affected SA8255P; affected SA8295P; affected SA8620P; affected SA8650P; affected SA8770P; affected SA8775P; affected SA9000P; affected SD 8 Gen1 5G; affected SG4150P; affected SG8275P; affected SM8550P; affected Snapdragon 4 Gen 1 Mobile Platform; affected Snapdragon 4 Gen 2 Mobile Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 480 5G Mobile Platform; affected Snapdragon 480+ 5G Mobile Platform (SM4350-AC); affected Snapdragon 662 Mobile Platform; affected Snapdragon 680 4G Mobile Platform; affected Snapdragon 685 4G Mobile Platform (SM6225-AD); affected Snapdragon 695 5G Mobile Platform; affected Snapdragon 8 Gen 1 Mobile Platform; affected Snapdragon 8 Gen 2 Mobile Platform; affected Snapdragon 8 Gen 3 Mobile Platform; affected Snapdragon 8+ Gen 1 Mobile Platform; affected Snapdragon 8+ Gen 2 Mobile Platform; affected Snapdragon AR2 Gen 1 Platform; affected Snapdragon W5+ Gen 1 Wearable Platform; affected SRV1H; affected SRV1L; affected SRV1M; affected SSG2115P; affected SSG2125P; affected SW5100; affected SW5100P; affected SXR1230P; affected SXR2230P; affected SXR2250P; affected TalynPlus; affected Vision Intelligence 400 Platform; affected WCD9335; affected WCD9341; affected WCD9370; affected WCD9375; affected WCD9380; affected WCD9385; affected WCD9390; affected WCD9395; affected WCN3950; affected WCN3980; affected WCN3988; affected WCN3990; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8832; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H

Vendor / product

Versions

Qualcomm, Inc. / Snapdragon

affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6900; affected FastConnect 7800; affected Flight RB5 5G Platform; affected QAM8255P; affected QAM8295P; affected QAM8620P; affected QAM8650P; affected QAM8775P; affected QAMSRV1H; affected QAMSRV1M; affected QCA6391; affected QCA6574; affected QCA6574A; affected QCA6574AU; affected QCA6595; affected QCA6595AU; affected QCA6678AQ; affected QCA6696; affected QCA6698AQ; affected QCA6797AQ; affected QCM4325; affected QCM4490; affected QCM5430; affected QCM6125; affected QCM6490; affected QCM8550; affected QCS4490; affected QCS5430; affected QCS6125; affected QCS6490; affected QCS7230; affected QCS8250; affected QCS8550; affected QRB5165N; affected Qualcomm Video Collaboration VC1 Platform; affected Qualcomm Video Collaboration VC3 Platform; affected Qualcomm Video Collaboration VC5 Platform; affected Robotics RB5 Platform; affected SA6155P; affected SA7255P; affected SA7775P; affected SA8155P; affected SA8195P; affected SA8255P; affected SA8295P; affected SA8620P; affected SA8650P; affected SA8770P; affected SA8775P; affected SA9000P; affected SD 8 Gen1 5G; affected SG4150P; affected SG8275P; affected SM8550P; affected Snapdragon 4 Gen 1 Mobile Platform; affected Snapdragon 4 Gen 2 Mobile Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 480 5G Mobile Platform; affected Snapdragon 480+ 5G Mobile Platform (SM4350-AC); affected Snapdragon 662 Mobile Platform; affected Snapdragon 680 4G Mobile Platform; affected Snapdragon 685 4G Mobile Platform (SM6225-AD); affected Snapdragon 695 5G Mobile Platform; affected Snapdragon 8 Gen 1 Mobile Platform; affected Snapdragon 8 Gen 2 Mobile Platform; affected Snapdragon 8 Gen 3 Mobile Platform; affected Snapdragon 8+ Gen 1 Mobile Platform; affected Snapdragon 8+ Gen 2 Mobile Platform; affected Snapdragon AR2 Gen 1 Platform; affected Snapdragon W5+ Gen 1 Wearable Platform; affected SRV1H; affected SRV1L; affected SRV1M; affected SSG2115P; affected SSG2125P; affected SW5100; affected SW5100P; affected SXR1230P; affected SXR2230P; affected SXR2250P; affected TalynPlus; affected Vision Intelligence 400 Platform; affected WCD9335; affected WCD9341; affected WCD9370; affected WCD9375; affected WCD9380; affected WCD9385; affected WCD9390; affected WCD9395; affected WCN3950; affected WCN3980; affected WCN3988; affected WCN3990; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8832; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H

CWE

CWE-416

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2024-bulletin.html

ADP enrichment

CISA-ADP

No English description supplied.

No references supplied.