CVE-2024-23385 — Reachable Assertion in Modem

Description (CNA)

Transient DOS as modem reset occurs when an unexpected MAC RAR (with invalid PDU length) is seen at UE.

Affected (CNA)

Vendor / product	Versions
Qualcomm, Inc. / Snapdragon	affected APQ8017; affected APQ8037; affected AR8035; affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6900; affected FastConnect 7800; affected FSM10055; affected FSM10056; affected MSM8108; affected MSM8209; affected MSM8608; affected QCA6174A; affected QCA6574A; affected QCA6574AU; affected QCA6584AU; affected QCA6595AU; affected QCA6696; affected QCA6698AQ; affected QCA8081; affected QCA8337; affected QCC710; affected QCM4490; affected QCM8550; affected QCN6024; affected QCN6224; affected QCN6274; affected QCN9024; affected QCS4490; affected QCS8550; affected QEP8111; affected QFW7114; affected QFW7124; affected Qualcomm 205 Mobile Platform; affected SDM429W; affected SDX55; affected SDX57M; affected SDX61; affected SDX71M; affected SG8275P; affected SM6370; affected SM8550P; affected SM8635; affected Smart Audio 200 Platform; affected Snapdragon 208 Processor; affected Snapdragon 210 Processor; affected Snapdragon 212 Mobile Platform; affected Snapdragon 4 Gen 1 Mobile Platform; affected Snapdragon 425 Mobile Platform; affected Snapdragon 429 Mobile Platform; affected Snapdragon 430 Mobile Platform; affected Snapdragon 439 Mobile Platform; affected Snapdragon 480 5G Mobile Platform; affected Snapdragon 480+ 5G Mobile Platform (SM4350-AC); affected Snapdragon 695 5G Mobile Platform; affected Snapdragon 8 Gen 1 Mobile Platform; affected Snapdragon 8 Gen 2 Mobile Platform; affected Snapdragon 8 Gen 3 Mobile Platform; affected Snapdragon 8+ Gen 1 Mobile Platform; affected Snapdragon 8+ Gen 2 Mobile Platform; affected Snapdragon Auto 5G Modem-RF Gen 2; affected Snapdragon Wear 4100+ Platform; affected Snapdragon X35 5G Modem-RF System; affected Snapdragon X62 5G Modem-RF System; affected Snapdragon X65 5G Modem-RF System; affected Snapdragon X70 Modem-RF System; affected Snapdragon X72 5G Modem-RF System; affected Snapdragon X75 5G Modem-RF System; affected WCD9326; affected WCD9340; affected WCD9360; affected WCD9370; affected WCD9375; affected WCD9380; affected WCD9385; affected WCD9390; affected WCD9395; affected WCN3610; affected WCN3615; affected WCN3620; affected WCN3660B; affected WCN3680B; affected WCN3950; affected WCN3980; affected WCN3988; affected WCN6755; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8832; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H

Vendor / product

Versions

Qualcomm, Inc. / Snapdragon

affected APQ8017; affected APQ8037; affected AR8035; affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6900; affected FastConnect 7800; affected FSM10055; affected FSM10056; affected MSM8108; affected MSM8209; affected MSM8608; affected QCA6174A; affected QCA6574A; affected QCA6574AU; affected QCA6584AU; affected QCA6595AU; affected QCA6696; affected QCA6698AQ; affected QCA8081; affected QCA8337; affected QCC710; affected QCM4490; affected QCM8550; affected QCN6024; affected QCN6224; affected QCN6274; affected QCN9024; affected QCS4490; affected QCS8550; affected QEP8111; affected QFW7114; affected QFW7124; affected Qualcomm 205 Mobile Platform; affected SDM429W; affected SDX55; affected SDX57M; affected SDX61; affected SDX71M; affected SG8275P; affected SM6370; affected SM8550P; affected SM8635; affected Smart Audio 200 Platform; affected Snapdragon 208 Processor; affected Snapdragon 210 Processor; affected Snapdragon 212 Mobile Platform; affected Snapdragon 4 Gen 1 Mobile Platform; affected Snapdragon 425 Mobile Platform; affected Snapdragon 429 Mobile Platform; affected Snapdragon 430 Mobile Platform; affected Snapdragon 439 Mobile Platform; affected Snapdragon 480 5G Mobile Platform; affected Snapdragon 480+ 5G Mobile Platform (SM4350-AC); affected Snapdragon 695 5G Mobile Platform; affected Snapdragon 8 Gen 1 Mobile Platform; affected Snapdragon 8 Gen 2 Mobile Platform; affected Snapdragon 8 Gen 3 Mobile Platform; affected Snapdragon 8+ Gen 1 Mobile Platform; affected Snapdragon 8+ Gen 2 Mobile Platform; affected Snapdragon Auto 5G Modem-RF Gen 2; affected Snapdragon Wear 4100+ Platform; affected Snapdragon X35 5G Modem-RF System; affected Snapdragon X62 5G Modem-RF System; affected Snapdragon X65 5G Modem-RF System; affected Snapdragon X70 Modem-RF System; affected Snapdragon X72 5G Modem-RF System; affected Snapdragon X75 5G Modem-RF System; affected WCD9326; affected WCD9340; affected WCD9360; affected WCD9370; affected WCD9375; affected WCD9380; affected WCD9385; affected WCD9390; affected WCD9395; affected WCN3610; affected WCN3615; affected WCN3620; affected WCN3660B; affected WCN3680B; affected WCN3950; affected WCN3980; affected WCN3988; affected WCN6755; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8832; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H

CWE

CWE-617

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/november-2024-bulletin.html

ADP enrichment

CISA-ADP

No English description supplied.

No references supplied.