CVE-2024-43066 — Use After Free in HLOS

Description (CNA)

Memory corruption while handling file descriptor during listener registration/de-registration.

Affected (CNA)

Vendor / product	Versions
Qualcomm, Inc. / Snapdragon	affected CSRB31024; affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6800; affected FastConnect 6900; affected FastConnect 7800; affected MDM9650; affected QAM8295P; affected QCA6310; affected QCA6335; affected QCA6391; affected QCA6426; affected QCA6436; affected QCA6564; affected QCA6564AU; affected QCA6574; affected QCA6574A; affected QCA6574AU; affected QCA6595; affected QCA6595AU; affected QCA6696; affected QCA6698AQ; affected QCM6490; affected QCS410; affected QCS610; affected QCS6490; affected QCS8550; affected Qualcomm 205 Mobile Platform; affected Qualcomm Video Collaboration VC1 Platform; affected Qualcomm Video Collaboration VC3 Platform; affected Robotics RB3 Platform; affected SA4150P; affected SA4155P; affected SA6145P; affected SA6150P; affected SA6155; affected SA6155P; affected SA8145P; affected SA8150P; affected SA8155; affected SA8155P; affected SA8195P; affected SA8295P; affected SD660; affected SD865 5G; affected SDM429W; affected SG4150P; affected SM4125; affected SM6370; affected Snapdragon 210 Processor; affected Snapdragon 212 Mobile Platform; affected Snapdragon 4 Gen 1 Mobile Platform; affected Snapdragon 429 Mobile Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 480 5G Mobile Platform; affected Snapdragon 480+ 5G Mobile Platform (SM4350-AC); affected Snapdragon 660 Mobile Platform; affected Snapdragon 662 Mobile Platform; affected Snapdragon 680 4G Mobile Platform; affected Snapdragon 685 4G Mobile Platform (SM6225-AD); affected Snapdragon 695 5G Mobile Platform; affected Snapdragon 820 Automotive Platform; affected Snapdragon 845 Mobile Platform; affected Snapdragon 865 5G Mobile Platform; affected Snapdragon 865+ 5G Mobile Platform (SM8250-AB); affected Snapdragon 870 5G Mobile Platform (SM8250-AC); affected Snapdragon Auto 5G Modem-RF; affected Snapdragon W5+ Gen 1 Wearable Platform; affected Snapdragon X55 5G Modem-RF System; affected Snapdragon XR1 Platform; affected Snapdragon XR2 5G Platform; affected Snapdragon Auto 4G Modem; affected SW5100; affected SW5100P; affected SXR1120; affected SXR2130; affected Vision Intelligence 400 Platform; affected WCD9326; affected WCD9335; affected WCD9340; affected WCD9341; affected WCD9370; affected WCD9375; affected WCD9380; affected WCD9385; affected WCN3610; affected WCN3620; affected WCN3660B; affected WCN3680B; affected WCN3910; affected WCN3950; affected WCN3980; affected WCN3988; affected WCN3990; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8835

Vendor / product

Versions

Qualcomm, Inc. / Snapdragon

affected CSRB31024; affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6800; affected FastConnect 6900; affected FastConnect 7800; affected MDM9650; affected QAM8295P; affected QCA6310; affected QCA6335; affected QCA6391; affected QCA6426; affected QCA6436; affected QCA6564; affected QCA6564AU; affected QCA6574; affected QCA6574A; affected QCA6574AU; affected QCA6595; affected QCA6595AU; affected QCA6696; affected QCA6698AQ; affected QCM6490; affected QCS410; affected QCS610; affected QCS6490; affected QCS8550; affected Qualcomm 205 Mobile Platform; affected Qualcomm Video Collaboration VC1 Platform; affected Qualcomm Video Collaboration VC3 Platform; affected Robotics RB3 Platform; affected SA4150P; affected SA4155P; affected SA6145P; affected SA6150P; affected SA6155; affected SA6155P; affected SA8145P; affected SA8150P; affected SA8155; affected SA8155P; affected SA8195P; affected SA8295P; affected SD660; affected SD865 5G; affected SDM429W; affected SG4150P; affected SM4125; affected SM6370; affected Snapdragon 210 Processor; affected Snapdragon 212 Mobile Platform; affected Snapdragon 4 Gen 1 Mobile Platform; affected Snapdragon 429 Mobile Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 480 5G Mobile Platform; affected Snapdragon 480+ 5G Mobile Platform (SM4350-AC); affected Snapdragon 660 Mobile Platform; affected Snapdragon 662 Mobile Platform; affected Snapdragon 680 4G Mobile Platform; affected Snapdragon 685 4G Mobile Platform (SM6225-AD); affected Snapdragon 695 5G Mobile Platform; affected Snapdragon 820 Automotive Platform; affected Snapdragon 845 Mobile Platform; affected Snapdragon 865 5G Mobile Platform; affected Snapdragon 865+ 5G Mobile Platform (SM8250-AB); affected Snapdragon 870 5G Mobile Platform (SM8250-AC); affected Snapdragon Auto 5G Modem-RF; affected Snapdragon W5+ Gen 1 Wearable Platform; affected Snapdragon X55 5G Modem-RF System; affected Snapdragon XR1 Platform; affected Snapdragon XR2 5G Platform; affected Snapdragon Auto 4G Modem; affected SW5100; affected SW5100P; affected SXR1120; affected SXR2130; affected Vision Intelligence 400 Platform; affected WCD9326; affected WCD9335; affected WCD9340; affected WCD9341; affected WCD9370; affected WCD9375; affected WCD9380; affected WCD9385; affected WCN3610; affected WCN3620; affected WCN3660B; affected WCN3680B; affected WCN3910; affected WCN3950; affected WCN3980; affected WCN3988; affected WCN3990; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8835

CWE

CWE-416

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2025-bulletin.html

ADP enrichment

CISA-ADP

No English description supplied.

No references supplied.