Description (CNA)
Memory corruption can occur when TME processes addresses from TZ and MPSS requests without proper validation.
Affected (CNA)
| Vendor / product | Versions |
|---|---|
| Qualcomm, Inc. / Snapdragon | affected AR8035; affected FastConnect 6700; affected FastConnect 6900; affected FastConnect 7800; affected QCA6174A; affected QCA6584AU; affected QCA6698AQ; affected QCA8081; affected QCA8337; affected QCC710; affected QCM4490; affected QCN6224; affected QCN6274; affected QCS4490; affected QDU1000; affected QDU1010; affected QDU1110; affected QDU1210; affected QDX1010; affected QDX1011; affected QEP8111; affected QFW7114; affected QFW7124; affected QRU1032; affected QRU1052; affected QRU1062; affected SC8380XP; affected SD 8 Gen1 5G; affected SM8635; affected Snapdragon 4 Gen 2 Mobile Platform; affected Snapdragon 8 Gen 1 Mobile Platform; affected Snapdragon 8 Gen 3 Mobile Platform; affected Snapdragon 8+ Gen 1 Mobile Platform; affected Snapdragon AR2 Gen 1 Platform; affected Snapdragon Auto 5G Modem-RF Gen 2; affected Snapdragon X35 5G Modem-RF System; affected Snapdragon X72 5G Modem-RF System; affected Snapdragon X75 5G Modem-RF System; affected SSG2115P; affected SSG2125P; affected SXR1230P; affected SXR2230P; affected TalynPlus; affected WCD9340; affected WCD9370; affected WCD9375; affected WCD9380; affected WCD9385; affected WCD9390; affected WCD9395; affected WCN3950; affected WCN3988; affected WCN6755; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8832; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H |
CWE
CWE-823
References
ADP enrichment
No English description supplied.
No references supplied.