CVE-2025-21488 — Buffer Over-read in Data Network Stack & Connectivity

Description (CNA)

Information disclosure while decoding this RTP packet headers received by UE from the network when the padding bit is set.

Affected (CNA)

Vendor / product	Versions
Qualcomm, Inc. / Snapdragon	affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6900; affected FastConnect 7800; affected MSM8996AU; affected QCA6564; affected QCA6564A; affected QCA6564AU; affected QCA6574; affected QCA6574A; affected QCA6574AU; affected QCA6595AU; affected QCA6696; affected QCM4490; affected QCS410; affected QCS4490; affected QCS610; affected QMP1000; affected Qualcomm Video Collaboration VC1 Platform; affected Qualcomm Video Collaboration VC3 Platform; affected SA6145P; affected SA6155; affected SA6155P; affected SA8155; affected SA8155P; affected SD 8 Gen1 5G; affected SD660; affected SD670; affected SD865 5G; affected SDM429W; affected SG4150P; affected SM4125; affected SM4635; affected SM6370; affected SM6650; affected SM7635; affected SM7675; affected SM7675P; affected SM8550P; affected SM8635; affected SM8635P; affected SM8650Q; affected SM8735; affected SM8750; affected SM8750P; affected Snapdragon 4 Gen 1 Mobile Platform; affected Snapdragon 4 Gen 2 Mobile Platform; affected Snapdragon 429 Mobile Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 480 5G Mobile Platform; affected Snapdragon 480+ 5G Mobile Platform (SM4350-AC); affected Snapdragon 660 Mobile Platform; affected Snapdragon 662 Mobile Platform; affected Snapdragon 670 Mobile Platform; affected Snapdragon 680 4G Mobile Platform; affected Snapdragon 685 4G Mobile Platform (SM6225-AD); affected Snapdragon 695 5G Mobile Platform; affected Snapdragon 710 Mobile Platform; affected Snapdragon 8 Gen 1 Mobile Platform; affected Snapdragon 8 Gen 2 Mobile Platform; affected Snapdragon 8 Gen 3 Mobile Platform; affected Snapdragon 8+ Gen 1 Mobile Platform; affected Snapdragon 8+ Gen 2 Mobile Platform; affected Snapdragon 820 Automotive Platform; affected Snapdragon 845 Mobile Platform; affected Snapdragon W5+ Gen 1 Wearable Platform; affected Snapdragon XR1 Platform; affected Snapdragon XR2 5G Platform; affected Snapdragon XR2+ Gen 1 Platform; affected SW5100; affected SW5100P; affected SXR1120; affected TalynPlus; affected WCD9326; affected WCD9335; affected WCD9340; affected WCD9341; affected WCD9370; affected WCD9375; affected WCD9378; affected WCD9380; affected WCD9385; affected WCD9390; affected WCD9395; affected WCN3620; affected WCN3660B; affected WCN3910; affected WCN3950; affected WCN3980; affected WCN3988; affected WCN3990; affected WCN6450; affected WCN6650; affected WCN6740; affected WCN6755; affected WCN7750; affected WCN7860; affected WCN7861; affected WCN7880; affected WCN7881; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8832; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H

Vendor / product

Versions

Qualcomm, Inc. / Snapdragon

affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6900; affected FastConnect 7800; affected MSM8996AU; affected QCA6564; affected QCA6564A; affected QCA6564AU; affected QCA6574; affected QCA6574A; affected QCA6574AU; affected QCA6595AU; affected QCA6696; affected QCM4490; affected QCS410; affected QCS4490; affected QCS610; affected QMP1000; affected Qualcomm Video Collaboration VC1 Platform; affected Qualcomm Video Collaboration VC3 Platform; affected SA6145P; affected SA6155; affected SA6155P; affected SA8155; affected SA8155P; affected SD 8 Gen1 5G; affected SD660; affected SD670; affected SD865 5G; affected SDM429W; affected SG4150P; affected SM4125; affected SM4635; affected SM6370; affected SM6650; affected SM7635; affected SM7675; affected SM7675P; affected SM8550P; affected SM8635; affected SM8635P; affected SM8650Q; affected SM8735; affected SM8750; affected SM8750P; affected Snapdragon 4 Gen 1 Mobile Platform; affected Snapdragon 4 Gen 2 Mobile Platform; affected Snapdragon 429 Mobile Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 480 5G Mobile Platform; affected Snapdragon 480+ 5G Mobile Platform (SM4350-AC); affected Snapdragon 660 Mobile Platform; affected Snapdragon 662 Mobile Platform; affected Snapdragon 670 Mobile Platform; affected Snapdragon 680 4G Mobile Platform; affected Snapdragon 685 4G Mobile Platform (SM6225-AD); affected Snapdragon 695 5G Mobile Platform; affected Snapdragon 710 Mobile Platform; affected Snapdragon 8 Gen 1 Mobile Platform; affected Snapdragon 8 Gen 2 Mobile Platform; affected Snapdragon 8 Gen 3 Mobile Platform; affected Snapdragon 8+ Gen 1 Mobile Platform; affected Snapdragon 8+ Gen 2 Mobile Platform; affected Snapdragon 820 Automotive Platform; affected Snapdragon 845 Mobile Platform; affected Snapdragon W5+ Gen 1 Wearable Platform; affected Snapdragon XR1 Platform; affected Snapdragon XR2 5G Platform; affected Snapdragon XR2+ Gen 1 Platform; affected SW5100; affected SW5100P; affected SXR1120; affected TalynPlus; affected WCD9326; affected WCD9335; affected WCD9340; affected WCD9341; affected WCD9370; affected WCD9375; affected WCD9378; affected WCD9380; affected WCD9385; affected WCD9390; affected WCD9395; affected WCN3620; affected WCN3660B; affected WCN3910; affected WCN3950; affected WCN3980; affected WCN3988; affected WCN3990; affected WCN6450; affected WCN6650; affected WCN6740; affected WCN6755; affected WCN7750; affected WCN7860; affected WCN7861; affected WCN7880; affected WCN7881; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8832; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H

CWE

CWE-126

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/september-2025-bulletin.html

ADP enrichment

CISA-ADP

No English description supplied.

No references supplied.