CVE-2025-27047 — Use After Free in Display

Description (CNA)

Memory corruption while processing the TESTPATTERNCONFIG escape path.

Affected (CNA)

Vendor / product	Versions
Qualcomm, Inc. / Snapdragon	affected FastConnect 6700; affected FastConnect 6900; affected FastConnect 7800; affected QCM5430; affected QCM6490; affected QCS5430; affected QCS6490; affected Qualcomm Video Collaboration VC3 Platform; affected SC8380XP; affected Snapdragon 7c+ Gen 3 Compute; affected Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB); affected WCD9370; affected WCD9375; affected WCD9380; affected WCD9385; affected WSA8830; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H

Vendor / product

Versions

Qualcomm, Inc. / Snapdragon

affected FastConnect 6700; affected FastConnect 6900; affected FastConnect 7800; affected QCM5430; affected QCM6490; affected QCS5430; affected QCS6490; affected Qualcomm Video Collaboration VC3 Platform; affected SC8380XP; affected Snapdragon 7c+ Gen 3 Compute; affected Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB); affected WCD9370; affected WCD9375; affected WCD9380; affected WCD9385; affected WSA8830; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H

CWE

CWE-416

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2025-bulletin.html

ADP enrichment

CISA-ADP

No English description supplied.

No references supplied.