Description (CNA)
Memory Corruption when accessing a buffer after it has been freed while processing IOCTL calls.
Affected (CNA)
| Vendor / product | Versions |
|---|---|
| Qualcomm, Inc. / Snapdragon | affected AR8035; affected FastConnect 6200; affected FastConnect 6900; affected FastConnect 7800; affected Flight RB5 5G Platform; affected FWA Gen 3 Ultra Platform; affected G1 Gen 1; affected LeMans_AU_LGIT; affected LeMansAU; affected Milos; affected QAM8255P; affected QAM8295P; affected QAMSRV1H; affected QAMSRV1M; affected QCA6174A; affected QCA6391; affected QCA6574; affected QCA6574A; affected QCA6574AU; affected QCA6584AU; affected QCA6595; affected QCA6595AU; affected QCA6678AQ; affected QCA6688AQ; affected QCA6696; affected QCA6698AQ; affected QCA6698AU; affected QCA6797AQ; affected QCA8081; affected QCA8337; affected QCA8695AU; affected QCA9367; affected QCA9377; affected QCC710; affected QCM2290; affected QCM4325; affected QCM6125; affected QCN6224; affected QCN6274; affected QCN9011; affected QCN9012; affected QCS2290; affected QCS4290; affected QCS8550; affected QEP8111; affected QFW7114; affected QFW7124; affected QRB5165N; affected Qualcomm Video Collaboration VC1 Platform; affected Qualcomm Video Collaboration VC5 Platform; affected Robotics RB5 Platform; affected SA6155P; affected SA7255P; affected SA7775P; affected SA8155P; affected SA8195P; affected SA8255P; affected SA8295P; affected SA8620P; affected SA8770P; affected SA9000P; affected SD662; affected SM6225P; affected SM6650P; affected SM7550; affected SM7550P; affected SM7635P; affected SM7675; affected SM7675P; affected SM8550P; affected SM8635; affected SM8635P; affected SM8650Q; affected Snapdragon 4 Gen 1 Mobile Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 480 5G Mobile Platform; affected Snapdragon 480+ 5G Mobile Platform; affected Snapdragon 6 Gen 4 Mobile Platform; affected Snapdragon 662 Mobile Platform; affected Snapdragon 680 4G Mobile Platform; affected Snapdragon 685 4G Mobile Platform; affected Snapdragon 695 5G Mobile Platform; affected Snapdragon 7s Gen 3 Mobile Platform; affected Snapdragon 8 Gen 2 Mobile Platform; affected Snapdragon 8 Gen 3 Mobile Platform; affected Snapdragon 8+ Gen 2 Mobile Platform; affected Snapdragon Auto 5G Modem-RF Gen 2; affected Snapdragon W5+ Gen 1 Wearable Platform; affected Snapdragon X32 5G Modem-RF System; affected Snapdragon X35 5G Modem-RF System; affected Snapdragon X72 5G Modem-RF System; affected Snapdragon X75 5G Modem-RF System; affected SRV1H; affected SRV1M; affected SW5100; affected SW5100P; affected SXR2330P; affected SXR2350P; affected WCD9340; affected WCD9370; affected WCD9371; affected WCD9375; affected WCD9378; affected WCD9380; affected WCD9385; affected WCD9390; affected WCD9395; affected WCN3910; affected WCN3950; affected WCN3980; affected WCN3988; affected WCN6450; affected WCN6650; affected WCN6755; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8832; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H |
CWE
CWE-416
References
ADP enrichment
No English description supplied.
No references supplied.