CVE-2025-47407 — Time-of-check Time-of-use (TOCTOU) Race Condition in DSP Service

Description (CNA)

Memory corruption while creating a process on the digital signal processor due to allocation failure at the kernel level.

Affected (CNA)

Vendor / product	Versions
Qualcomm, Inc. / Snapdragon	affected CQ7790; affected CQ8725S; affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6900; affected FastConnect 7800; affected G2 Gen 1; affected Molokai; affected Netrani; affected Orne; affected Palawan25; affected Pandeiro; affected QCA6391; affected QCM2290; affected QCM4325; affected QCS2290; affected QCS4290; affected QLN1083BD; affected QLN1086BD; affected QMB715; affected QMP1000; affected QMP2001; affected QPA1083BD; affected QPA1086BD; affected Qualcomm Video Collaboration VC1 Platform; affected Qualcomm Video Collaboration VC3 Platform; affected QXM1083; affected QXM1086; affected QXM1093; affected QXM1094; affected QXM1095; affected QXM1096; affected SAR1165P; affected SAR2130P; affected SC8380XP; affected SD662; affected SD865 5G; affected SM6225P; affected SM6450P; affected SM6475P; affected SM6475Q; affected SM6850; affected SM7435; affected SM7435P; affected SM7635P; affected SM8735P; affected SM8750P; affected SM8845P; affected Snapdragon 4 Gen 2 Mobile Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 6 Gen 1 Mobile Platform; affected Snapdragon 6 Gen 3 Mobile Platform; affected Snapdragon 662 Mobile Platform; affected Snapdragon 680 4G Mobile Platform; affected Snapdragon 685 4G Mobile Platform; affected Snapdragon 7 Gen 4 Mobile Platform; affected Snapdragon 8 Elite; affected Snapdragon 8 Elite Gen 5; affected Snapdragon AR1+ Gen 1 Platform; affected Snapdragon W5+ Gen 1 Wearable Platform; affected Snapdragon XR2 5G Platform; affected Snapdragon XR2+ Gen 1 Platform; affected Snapdragon Wear Elite platform; affected SW5100; affected SW5100P; affected SXR2230P; affected SXR2250P; affected SXR2330P; affected SXR2350P; affected Themisto; affected WCD9370; affected WCD9375; affected WCD9378; affected WCD9380; affected WCD9385; affected WCD9395; affected WCN3950; affected WCN3980; affected WCN3988; affected WCN6450; affected WCN6755; affected WCN7760; affected WCN7860; affected WCN7861; affected WCN7880; affected WCN7881; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8832; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H; affected WSA8850; affected WSA8850W; affected WSA8855C; affected X1E80100; affected XRV7209; affected XRV9209

Vendor / product

Versions

Qualcomm, Inc. / Snapdragon

affected CQ7790; affected CQ8725S; affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6900; affected FastConnect 7800; affected G2 Gen 1; affected Molokai; affected Netrani; affected Orne; affected Palawan25; affected Pandeiro; affected QCA6391; affected QCM2290; affected QCM4325; affected QCS2290; affected QCS4290; affected QLN1083BD; affected QLN1086BD; affected QMB715; affected QMP1000; affected QMP2001; affected QPA1083BD; affected QPA1086BD; affected Qualcomm Video Collaboration VC1 Platform; affected Qualcomm Video Collaboration VC3 Platform; affected QXM1083; affected QXM1086; affected QXM1093; affected QXM1094; affected QXM1095; affected QXM1096; affected SAR1165P; affected SAR2130P; affected SC8380XP; affected SD662; affected SD865 5G; affected SM6225P; affected SM6450P; affected SM6475P; affected SM6475Q; affected SM6850; affected SM7435; affected SM7435P; affected SM7635P; affected SM8735P; affected SM8750P; affected SM8845P; affected Snapdragon 4 Gen 2 Mobile Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 6 Gen 1 Mobile Platform; affected Snapdragon 6 Gen 3 Mobile Platform; affected Snapdragon 662 Mobile Platform; affected Snapdragon 680 4G Mobile Platform; affected Snapdragon 685 4G Mobile Platform; affected Snapdragon 7 Gen 4 Mobile Platform; affected Snapdragon 8 Elite; affected Snapdragon 8 Elite Gen 5; affected Snapdragon AR1+ Gen 1 Platform; affected Snapdragon W5+ Gen 1 Wearable Platform; affected Snapdragon XR2 5G Platform; affected Snapdragon XR2+ Gen 1 Platform; affected Snapdragon Wear Elite platform; affected SW5100; affected SW5100P; affected SXR2230P; affected SXR2250P; affected SXR2330P; affected SXR2350P; affected Themisto; affected WCD9370; affected WCD9375; affected WCD9378; affected WCD9380; affected WCD9385; affected WCD9395; affected WCN3950; affected WCN3980; affected WCN3988; affected WCN6450; affected WCN6755; affected WCN7760; affected WCN7860; affected WCN7861; affected WCN7880; affected WCN7881; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8832; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H; affected WSA8850; affected WSA8850W; affected WSA8855C; affected X1E80100; affected XRV7209; affected XRV9209

CWE

CWE-367

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/may-2026-bulletin.html

ADP enrichment

CISA-ADP

No English description supplied.

No references supplied.