CVE-2025-59605 — Out-of-bounds Write in HLOS

Description (CNA)

Memory Corruption when processing device identifier strings that exceed the expected maximum length.

Affected (CNA)

Vendor / product	Versions
Qualcomm, Inc. / Snapdragon	affected AR8035; affected CSRA6620; affected CSRA6640; affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6800; affected FastConnect 6900; affected FastConnect 7800; affected Flight RB5 5G Platform; affected G1 Gen 1; affected QAM8255P; affected QAM8295P; affected QCA6174A; affected QCA6391; affected QCA6574; affected QCA6574A; affected QCA6574AU; affected QCA6595; affected QCA6595AU; affected QCA6678AQ; affected QCA6688AQ; affected QCA6696; affected QCA6698AQ; affected QCA6698AU; affected QCA6797AQ; affected QCA8081; affected QCA8337; affected QCM2290; affected QCM4325; affected QCM4490; affected QCM5430; affected QCM6125; affected QCM6490; affected QCN6024; affected QCN9011; affected QCN9012; affected QCN9024; affected QCS2290; affected QCS4290; affected QCS4490; affected QCS8550; affected QDX1010; affected QDX1011; affected QRB5165M; affected QRB5165N; affected QRU1032; affected Qualcomm Dragonwing QRU100 Platform; affected Qualcomm Dragonwing X100 Accelerator Card; affected Qualcomm Video Collaboration VC1 Platform; affected Qualcomm Video Collaboration VC3 Platform; affected Qualcomm Video Collaboration VC5 Platform; affected Robotics RB2 Platform; affected Robotics RB5 Platform; affected SA4150P; affected SA4155P; affected SA6145P; affected SA6150P; affected SA6155P; affected SA8145P; affected SA8150P; affected SA8155P; affected SA8195P; affected SA8255P; affected SA8295P; affected SA8540P; affected SA9000P; affected SAR2130P; affected SD 8 Gen1 5G; affected SD662; affected SD865 5G; affected SDX61; affected SM6225P; affected SM7250P; affected SM7325P; affected SM7435; affected SM7550; affected SM7550P; affected SM8475P; affected SM8550P; affected Snapdragon 4 Gen 1 Mobile Platform; affected Snapdragon 4 Gen 2 Mobile Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 480 5G Mobile Platform; affected Snapdragon 480+ 5G Mobile Platform; affected Snapdragon 6 Gen 1 Mobile Platform; affected Snapdragon 662 Mobile Platform; affected Snapdragon 680 4G Mobile Platform; affected Snapdragon 685 4G Mobile Platform; affected Snapdragon 690 5G Mobile Platform; affected Snapdragon 695 5G Mobile Platform; affected Snapdragon 7 Gen 1 Mobile Platform; affected Snapdragon 7+ Gen 2 Mobile Platform; affected Snapdragon 720G Mobile Platform; affected Snapdragon 765 5G Mobile Platform; affected Snapdragon 765G 5G Mobile Platform; affected Snapdragon 768G 5G Mobile Platform; affected Snapdragon 778G 5G Mobile Platform; affected Snapdragon 778G+ 5G Mobile Platform; affected Snapdragon 782G Mobile Platform; affected Snapdragon 7c+ Gen 3 Compute; affected Snapdragon 8 Gen 1 Mobile Platform; affected Snapdragon 8 Gen 2 Mobile Platform; affected Snapdragon 8+ Gen 1 Mobile Platform; affected Snapdragon 8+ Gen 2 Mobile Platform; affected Snapdragon 865 5G Mobile Platform; affected Snapdragon 865+ 5G Mobile Platform; affected Snapdragon 870 5G Mobile Platform; affected Snapdragon 888 5G Mobile Platform; affected Snapdragon 888+ 5G Mobile Platform; affected Snapdragon AR1 Gen 1 Platform; affected Snapdragon W5+ Gen 1 Wearable Platform; affected Snapdragon X53 5G Modem-RF System; affected Snapdragon X55 5G Modem-RF System; affected Snapdragon X65 5G Modem-RF System; affected Snapdragon XR2 5G Platform; affected Snapdragon XR2+ Gen 1 Platform; affected SW5100; affected SW5100P; affected SXR2230P; affected SXR2250P; affected WCD9335; affected WCD9370; affected WCD9371; affected WCD9375; affected WCD9378; affected WCD9380; affected WCD9385; affected WCD9390; affected WCD9395; affected WCN3910; affected WCN3950; affected WCN3980; affected WCN3988; affected WCN6650; affected WCN6755; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8832; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H

Vendor / product

Versions

Qualcomm, Inc. / Snapdragon

affected AR8035; affected CSRA6620; affected CSRA6640; affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6800; affected FastConnect 6900; affected FastConnect 7800; affected Flight RB5 5G Platform; affected G1 Gen 1; affected QAM8255P; affected QAM8295P; affected QCA6174A; affected QCA6391; affected QCA6574; affected QCA6574A; affected QCA6574AU; affected QCA6595; affected QCA6595AU; affected QCA6678AQ; affected QCA6688AQ; affected QCA6696; affected QCA6698AQ; affected QCA6698AU; affected QCA6797AQ; affected QCA8081; affected QCA8337; affected QCM2290; affected QCM4325; affected QCM4490; affected QCM5430; affected QCM6125; affected QCM6490; affected QCN6024; affected QCN9011; affected QCN9012; affected QCN9024; affected QCS2290; affected QCS4290; affected QCS4490; affected QCS8550; affected QDX1010; affected QDX1011; affected QRB5165M; affected QRB5165N; affected QRU1032; affected Qualcomm Dragonwing QRU100 Platform; affected Qualcomm Dragonwing X100 Accelerator Card; affected Qualcomm Video Collaboration VC1 Platform; affected Qualcomm Video Collaboration VC3 Platform; affected Qualcomm Video Collaboration VC5 Platform; affected Robotics RB2 Platform; affected Robotics RB5 Platform; affected SA4150P; affected SA4155P; affected SA6145P; affected SA6150P; affected SA6155P; affected SA8145P; affected SA8150P; affected SA8155P; affected SA8195P; affected SA8255P; affected SA8295P; affected SA8540P; affected SA9000P; affected SAR2130P; affected SD 8 Gen1 5G; affected SD662; affected SD865 5G; affected SDX61; affected SM6225P; affected SM7250P; affected SM7325P; affected SM7435; affected SM7550; affected SM7550P; affected SM8475P; affected SM8550P; affected Snapdragon 4 Gen 1 Mobile Platform; affected Snapdragon 4 Gen 2 Mobile Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 480 5G Mobile Platform; affected Snapdragon 480+ 5G Mobile Platform; affected Snapdragon 6 Gen 1 Mobile Platform; affected Snapdragon 662 Mobile Platform; affected Snapdragon 680 4G Mobile Platform; affected Snapdragon 685 4G Mobile Platform; affected Snapdragon 690 5G Mobile Platform; affected Snapdragon 695 5G Mobile Platform; affected Snapdragon 7 Gen 1 Mobile Platform; affected Snapdragon 7+ Gen 2 Mobile Platform; affected Snapdragon 720G Mobile Platform; affected Snapdragon 765 5G Mobile Platform; affected Snapdragon 765G 5G Mobile Platform; affected Snapdragon 768G 5G Mobile Platform; affected Snapdragon 778G 5G Mobile Platform; affected Snapdragon 778G+ 5G Mobile Platform; affected Snapdragon 782G Mobile Platform; affected Snapdragon 7c+ Gen 3 Compute; affected Snapdragon 8 Gen 1 Mobile Platform; affected Snapdragon 8 Gen 2 Mobile Platform; affected Snapdragon 8+ Gen 1 Mobile Platform; affected Snapdragon 8+ Gen 2 Mobile Platform; affected Snapdragon 865 5G Mobile Platform; affected Snapdragon 865+ 5G Mobile Platform; affected Snapdragon 870 5G Mobile Platform; affected Snapdragon 888 5G Mobile Platform; affected Snapdragon 888+ 5G Mobile Platform; affected Snapdragon AR1 Gen 1 Platform; affected Snapdragon W5+ Gen 1 Wearable Platform; affected Snapdragon X53 5G Modem-RF System; affected Snapdragon X55 5G Modem-RF System; affected Snapdragon X65 5G Modem-RF System; affected Snapdragon XR2 5G Platform; affected Snapdragon XR2+ Gen 1 Platform; affected SW5100; affected SW5100P; affected SXR2230P; affected SXR2250P; affected WCD9335; affected WCD9370; affected WCD9371; affected WCD9375; affected WCD9378; affected WCD9380; affected WCD9385; affected WCD9390; affected WCD9395; affected WCN3910; affected WCN3950; affected WCN3980; affected WCN3988; affected WCN6650; affected WCN6755; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8832; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H

CWE

CWE-787

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2026-bulletin.html

ADP enrichment

CISA-ADP

No English description supplied.

No references supplied.