CVE-2026-21369 — Out-of-bounds Write in Camera Driver

Description (CNA)

Memory Corruption when handling flash commands due to outdated LED count values being used after userspace modification.

Affected (CNA)

Vendor / product	Versions
Qualcomm, Inc. / Snapdragon	affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6900; affected FastConnect 7800; affected G1 Gen 1; affected G3x Gen 2; affected IQ9 Series Platform; affected Kalpeni; affected LeMans_AU_LGIT; affected LeMansAU; affected Pandeiro; affected QAM8255P; affected QAM8295P; affected QAMSRV1H; affected QAMSRV1M; affected QCA6574AU; affected QCA6595; affected QCA6688AQ; affected QCA6696; affected QCA6698AQ; affected QCA6797AQ; affected QCA8695AU; affected QCM2290; affected QCM4325; affected QCM4490; affected QCM5430; affected QCM6490; affected QCM8838; affected QCS2290; affected QCS4290; affected QCS4490; affected QLN1083BD; affected QLN1086BD; affected QPA1083BD; affected QPA1086BD; affected Qualcomm Video Collaboration VC3 Platform; affected QXM1093; affected QXM1094; affected QXM1095; affected QXM1096; affected SA6155P; affected SA7255P; affected SA7775P; affected SA8155P; affected SA8195P; affected SA8255P; affected SA8295P; affected SA8620P; affected SA8770P; affected SA9000P; affected SAR2130P; affected SC8380XP; affected SD662; affected SD865 5G; affected SDR753; affected SM6225P; affected SM7525; affected SM7550; affected SM7550P; affected SM8550P; affected Snapdragon 4 Gen 1 Mobile Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 480 5G Mobile Platform; affected Snapdragon 480+ 5G Mobile Platform; affected Snapdragon 662 Mobile Platform; affected Snapdragon 680 4G Mobile Platform; affected Snapdragon 685 4G Mobile Platform; affected Snapdragon 695 5G Mobile Platform; affected Snapdragon 8 Elite; affected Snapdragon 8 Gen 2 Mobile Platform; affected Snapdragon 8+ Gen 2 Mobile Platform; affected Snapdragon AR1 Gen 1 Platform; affected Snapdragon XR2 5G Platform; affected Snapdragon XR2+ Gen 1 Platform; affected Snapdragon Wear Elite platform; affected SRV1H; affected SRV1M; affected SXR2230P; affected SXR2330P; affected SXR2350P; affected Themisto; affected WCD9370; affected WCD9371; affected WCD9375; affected WCD9378; affected WCD9380; affected WCD9385; affected WCD9390; affected WCD9395; affected WCN3910; affected WCN3950; affected WCN3988; affected WCN6450; affected WCN6650; affected WCN6755; affected WCN7860; affected WCN7861; affected WCN7881; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8832; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H; affected X1E80100; affected XRV7209; affected XRV9209

Vendor / product

Versions

Qualcomm, Inc. / Snapdragon

affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6900; affected FastConnect 7800; affected G1 Gen 1; affected G3x Gen 2; affected IQ9 Series Platform; affected Kalpeni; affected LeMans_AU_LGIT; affected LeMansAU; affected Pandeiro; affected QAM8255P; affected QAM8295P; affected QAMSRV1H; affected QAMSRV1M; affected QCA6574AU; affected QCA6595; affected QCA6688AQ; affected QCA6696; affected QCA6698AQ; affected QCA6797AQ; affected QCA8695AU; affected QCM2290; affected QCM4325; affected QCM4490; affected QCM5430; affected QCM6490; affected QCM8838; affected QCS2290; affected QCS4290; affected QCS4490; affected QLN1083BD; affected QLN1086BD; affected QPA1083BD; affected QPA1086BD; affected Qualcomm Video Collaboration VC3 Platform; affected QXM1093; affected QXM1094; affected QXM1095; affected QXM1096; affected SA6155P; affected SA7255P; affected SA7775P; affected SA8155P; affected SA8195P; affected SA8255P; affected SA8295P; affected SA8620P; affected SA8770P; affected SA9000P; affected SAR2130P; affected SC8380XP; affected SD662; affected SD865 5G; affected SDR753; affected SM6225P; affected SM7525; affected SM7550; affected SM7550P; affected SM8550P; affected Snapdragon 4 Gen 1 Mobile Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 480 5G Mobile Platform; affected Snapdragon 480+ 5G Mobile Platform; affected Snapdragon 662 Mobile Platform; affected Snapdragon 680 4G Mobile Platform; affected Snapdragon 685 4G Mobile Platform; affected Snapdragon 695 5G Mobile Platform; affected Snapdragon 8 Elite; affected Snapdragon 8 Gen 2 Mobile Platform; affected Snapdragon 8+ Gen 2 Mobile Platform; affected Snapdragon AR1 Gen 1 Platform; affected Snapdragon XR2 5G Platform; affected Snapdragon XR2+ Gen 1 Platform; affected Snapdragon Wear Elite platform; affected SRV1H; affected SRV1M; affected SXR2230P; affected SXR2330P; affected SXR2350P; affected Themisto; affected WCD9370; affected WCD9371; affected WCD9375; affected WCD9378; affected WCD9380; affected WCD9385; affected WCD9390; affected WCD9395; affected WCN3910; affected WCN3950; affected WCN3988; affected WCN6450; affected WCN6650; affected WCN6755; affected WCN7860; affected WCN7861; affected WCN7881; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8832; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H; affected X1E80100; affected XRV7209; affected XRV9209

CWE

CWE-787

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2026-bulletin.html

ADP enrichment

CISA-ADP

No English description supplied.

No references supplied.