CVE-2026-21371 — Buffer Over-read in WinBlast Driver

Description (CNA)

Memory Corruption when retrieving output buffer with insufficient size validation.

Affected (CNA)

Vendor / product	Versions
Qualcomm, Inc. / Snapdragon	affected AQT1000; affected Cologne; affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6800; affected FastConnect 6900; affected FastConnect 7800; affected QCA0000; affected QCA6391; affected QCA6420; affected QCA6430; affected QCM5430; affected QCM6490; affected Qualcomm Video Collaboration VC3 Platform; affected SC8380XP; affected SM6250; affected Snapdragon 460 Mobile Platform; affected Snapdragon 662 Mobile Platform; affected Snapdragon 7c Compute Platform; affected Snapdragon 7c Gen 2 Compute Platform "Rennell Pro"; affected Snapdragon 7c+ Gen 3 Compute; affected Snapdragon 8c Compute Platform "Poipu Lite"; affected Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite"; affected Snapdragon 8cx Compute Platform; affected Snapdragon 8cx Compute Platform "Poipu Pro"; affected Snapdragon 8cx Gen 2 5G Compute Platform; affected Snapdragon 8cx Gen 2 5G Compute Platform "Poipu Pro"; affected Snapdragon 8cx Gen 3 Compute Platform; affected WCD9340; affected WCD9341; affected WCD9370; affected WCD9375; affected WCD9378C; affected WCD9380; affected WCD9385; affected WCN3950; affected WCN3988; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H; affected X2000077; affected X2000086; affected X2000090; affected X2000092; affected X2000094; affected XG101002; affected XG101032; affected XG101039

Vendor / product

Versions

Qualcomm, Inc. / Snapdragon

affected AQT1000; affected Cologne; affected FastConnect 6200; affected FastConnect 6700; affected FastConnect 6800; affected FastConnect 6900; affected FastConnect 7800; affected QCA0000; affected QCA6391; affected QCA6420; affected QCA6430; affected QCM5430; affected QCM6490; affected Qualcomm Video Collaboration VC3 Platform; affected SC8380XP; affected SM6250; affected Snapdragon 460 Mobile Platform; affected Snapdragon 662 Mobile Platform; affected Snapdragon 7c Compute Platform; affected Snapdragon 7c Gen 2 Compute Platform "Rennell Pro"; affected Snapdragon 7c+ Gen 3 Compute; affected Snapdragon 8c Compute Platform "Poipu Lite"; affected Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite"; affected Snapdragon 8cx Compute Platform; affected Snapdragon 8cx Compute Platform "Poipu Pro"; affected Snapdragon 8cx Gen 2 5G Compute Platform; affected Snapdragon 8cx Gen 2 5G Compute Platform "Poipu Pro"; affected Snapdragon 8cx Gen 3 Compute Platform; affected WCD9340; affected WCD9341; affected WCD9370; affected WCD9375; affected WCD9378C; affected WCD9380; affected WCD9385; affected WCN3950; affected WCN3988; affected WSA8810; affected WSA8815; affected WSA8830; affected WSA8835; affected WSA8840; affected WSA8845; affected WSA8845H; affected X2000077; affected X2000086; affected X2000090; affected X2000092; affected X2000094; affected XG101002; affected XG101032; affected XG101039

CWE

CWE-126

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2026-bulletin.html

ADP enrichment

CISA-ADP

No English description supplied.

No references supplied.