CVE-2026-21372 — Heap-Based Buffer Overflow in Power Management IC

Description (CNA)

Memory Corruption when sending IOCTL requests with invalid buffer sizes during memcpy operations.

Affected (CNA)

Vendor / product	Versions
Qualcomm, Inc. / Snapdragon	affected Cologne; affected FastConnect 6700; affected FastConnect 6900; affected FastConnect 7800; affected QCM5430; affected QCM6490; affected Qualcomm Video Collaboration VC3 Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 662 Mobile Platform; affected Snapdragon 7c+ Gen 3 Compute; affected WCD9370; affected WCD9375; affected WCD9378C; affected WCD9380; affected WCD9385; affected WCN3950; affected WCN3988; affected WSA8840; affected WSA8845; affected WSA8845H; affected X2000077; affected X2000086; affected X2000090; affected X2000092; affected X2000094; affected XG101002; affected XG101032; affected XG101039

Vendor / product

Versions

Qualcomm, Inc. / Snapdragon

affected Cologne; affected FastConnect 6700; affected FastConnect 6900; affected FastConnect 7800; affected QCM5430; affected QCM6490; affected Qualcomm Video Collaboration VC3 Platform; affected Snapdragon 460 Mobile Platform; affected Snapdragon 662 Mobile Platform; affected Snapdragon 7c+ Gen 3 Compute; affected WCD9370; affected WCD9375; affected WCD9378C; affected WCD9380; affected WCD9385; affected WCN3950; affected WCN3988; affected WSA8840; affected WSA8845; affected WSA8845H; affected X2000077; affected X2000086; affected X2000090; affected X2000092; affected X2000094; affected XG101002; affected XG101032; affected XG101039

CWE

CWE-122

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2026-bulletin.html

ADP enrichment

CISA-ADP

No English description supplied.

No references supplied.